DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Revision “D” Specification Revision Status . XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 3-, 4- and 6-pair designs. XCede HD achieves the highest performance in an HM compatible form factor. 6. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Change Location. One-Piece Interface PCB Array Connectors Memory Card Connectors Custom Products VITA 42 XMC VITA 57. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). XCede® connectors also address. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. Discover More. 1. DETAILS. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. In this category | In this category, (Amphenol) Memory card connector / PCI CCM01 MK5 Series. jx410-51594 rev drawing no. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 1. 1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or. Typically, XCede compliant pins will require an insertion force of 2-10 lbs/pin. Skip to Main Content (800) 346-6873. 00mm: 2 - 54: 1. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. 8 mm, Header, Press Fit. DETAILS. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. Up to 82 differential pairs. Get a Free Sample. The XCede ® I/O connector supports next generation 100G+ applications and. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 2 mm, Receptacle, Press Fit, 2 Rows. Get a Free Sample. 6. {{metaDescription}} FCI’s XCede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. Female pin. Integrated guidance, keying and polarizing side walls available. Description. 3. BACKPANEL CONNECTORS BACKPLANE CONNECTOR SYSTEM XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. 1. 1K+ bought in past month. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. DETAILS. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. 2. Skip to Main Content (800) 346-6873. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office! 🤝🏙️ Excellent insights were shared by our distinguished speakers: 🌟 🎙️ Jon Howard from the BBC 🎙️ Chris Soulier from Cinch 🎙️ Gemma Turner from The Very. 99 $ 19. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. 6. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. 54mm pitch down to 0. 2. The XCede HD2 connector family consists of modular configurations with custom power and guidance. Login or REGISTER Hello, {0}. 80 mm High-Density Backplane Right-Angle Receptacle. 2. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. KK connector systems are customizable for a variety of power and signal applications. Login or REGISTER Hello, {0}. 2. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. 0” Long. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. Meets the high density needs of today's designs. XCede Connectors are available at Mouser Electronics. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Features. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. 11. 4. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. $ 129. 54, 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. English. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Mouser offers inventory, pricing, & datasheets for Amphenol XCede High Speed / Modular Connectors. Skip to Main Content (800) 346-6873. 80 mm高密度背板垂直插头. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. The XHD+ DC system will offer two (2) primary guidance systems, (1) the standard guide module receptacle; and (2) the wide guide. $19. For optimal connector configuration, connectors are grouped into signal modules of 4,. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede HD, Backplane Connectors, Right Angle Header LC, 4-pair, 8-column, 85ohms. 8 mm, Header, Press Fit. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. EBCF. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions. 7mil Drill Minimum Pad Size vs. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. For XCede HD RAM. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Features & Benefits. 2-to-PCIE-x4 adapter cable - but it runs $150. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. We would like to show you a description here but the site won’t allow us. 4 - Four (4) Onboardports by default . . Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. 0 REFERENCE 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. DC connector configurations are determined by the customers’ system application. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. Buy XCede HD Series Backplane Connectors. Commercial Standards 2. 6 %âãÏÓ 2647 0 obj > endobj 2677 0 obj >/Encrypt 2648 0 R/Filter/FlateDecode/ID[65646E18716E2B4991C9C621A98364C7>]/Index[2647 447]/Info 2646 0 R/Length 155. 4. Выбрать и купить Board-to-board connector / right-angle - XCede® RAM Amphenol вы можете у наших менеджеров, позвонив по телефону в Санкт-Петербурге 645-08-06. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. refer to tb-2235 for xcede hd product specifications. 2. 1. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. com. 3. XCede Connectors are available at Mouser Electronics. We chose the Asus Prime X470-Pro for its inclusion of many modern. Each ball and socket mount is designed and manufactured using the highest quality materials, and is backed by a lifetime warranty. 7. 1. 2. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. HDTM. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics. EN. Backwards mating compatible with XCede ® HD connector. Login or REGISTER Hello, {0}. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. Login or REGISTER Hello, {0}. by Xcede. The 0. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. Samtec XCede® HD 3. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 7. 1. XCede HD achieves the highest performance in an HM compatible form factor. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. These connectors are available in 3-, 4- and 6-Pair configurations. Features & Benefits. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCede® connectors also address. 2" long and has an x4 connector. Features. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. 2 Host Interface Connector The BCM957504-N425G OCP network adapter interfaces with the system baseboard via the gold fingers compliant with the SFF-TA-1002 specification. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. performance (up to 28+ Gb/s) in a Hard Metric form factor. See Figure 15 for details. 信号端子上可实现高达3. Amphenol TCS XCede® Backplane Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 00 mm contact wipe on signal pins. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. 4、6或8列. 80mm Right-Angle Backplane Receptacle (HDTF). Your Price. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. 3. English. Login or REGISTER Hello, {0}. challenging architectures. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. You previously purchased this product. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. XCede HD achieves the highest performance in an HM compatible form factor. Modular design provides flexibility in applications. Change Location. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. If you use the QSFP transceivers in the QSFP28 100G port, keep in mind that you have both single-mode and multimode (SR/LR) optical transceivers and Twinax/AOC options that are. Login or REGISTER Hello, {0}. Back. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. 0177" drill, nano ni, std gold 1. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. SERIES Maximum signal pins Terminal pin orientation Connector Length Type Termination Row REMARKS; HM2A30: 6 Spl: Vertical: 50. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. . 12 - 48 pairs. 384 likes · 6 talking about this · 259 were here. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Contact Mouser (USA) (800) 346-6873 | Feedback. These modules consist of a 12. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. . XCede® connectors also address. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Features. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. Upload your CV. XCede ® HD is a small form factor system with a modular design for significant space savings and. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. XCede® connectors also address. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 28 Figure 15: XCede pressing Force vs. Aug 25, 2011XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Choice of 2 or 4 power banks. 3. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. 12 - 48 pairs. Electrical & Mechanical Models. English. 00 mm的触点滑动范围. 3. connector contacts The COB system satisfies the most various installation needs thanks to the interchangeability of the connector inserts. This document is intended to serve as an application guide for designing the XCede HD connector system into various customer system configurations. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 1. Amphenol is one of the leading manufacturers of Backplane connectors. 40G QSFP+ to QSFP+ DAC Cable. Please confirm your currency selection:2. 1. Subscribe news. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. 8 mm column pitch representing a 35% increase versus XCede®. Login or REGISTER Hello, {0}. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. 80 mm column pitch. XCede ® HD2 § XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 5 out of 5 stars 3,424. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. . DETAILS. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. XCEDE CONNECTOR ECCN / UNSPSC / COO. Manufacturer of Connector and Connector Systems. 10% coupon applied at checkout Save 10% Details. Description Initial Date “-“ S1188 Initial Release T. 4, 6 or 8 columns. XCede® connectors also. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. Reboot the switch to enable the change. Skip to content. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Click OK to extend your time for an additional 30 minutes. XCede® connectors also address. 8 mm, Receptacle, Press Fit. 1. 1. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine,. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. Part # dimensions for each XCede connector type. Revision SCR No. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. - FCI. 1. 4. 80 mm高密度背板垂直插头. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. Power blades rated up to 60 A per power bank. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). VVG-Befestigungstechnik GmbH & Co. Login or REGISTER Hello, {0}. Formed in 2020 by a merger of three well-established organisations — TechStream, Xcede and Etonwood — our mission is to attract the talent that is helping our clients shape the new global economyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 1. Skip to Main Content +49 (0)89 520 462 110. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. . ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 使用Samtec的高速板对板Solutionator®构建您的对接连接器套件 。. 1. 96 and 5. Figure A-9 shows this requirement pictorially. DETAILS. Basics is present with its full range of products to meet the needs of our customers. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Description Initial Date “-“ S1188 Initial Release T. 2. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. These connectors are two-piece devices that connect two printed circuit boards. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Delete of interface FortyGigE1/0/49, and then exit the system mode and save the configuration. 1. This card can be used in an ITX system with an M. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 4, 6 or 8 columns. 6 XCede RAM and Extended RAM 2 Pair Application Tools 694-4528-000 – 2-Pair RAM Loading Head 1. 54 - 5. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. 1. Dislaime Please note that the above information is subect to change without notice. 0 - 30. XCedeHD RAM and XCede HD Inverted RAMrefer to. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Contact Mouser (USA) (800) 346-6873 | Feedback. 2. Vertical or Right Angle. 10120130-Y0J-20DLF Datasheets | Backplane Connectors Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Right By apogeeweb, 10120130-Y0J-20DLF, 10120130-Y0J-20DLF Datasheet,10120130-Y0J-20DLF PDF,Amphenol ICC (FCI)XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. They are available in 1. Available with 40, 60 and 80 signal pins. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Find Parts Learn More. backplane to expander board connector (BP_XCEDE_2) 3. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1.